TF1800 BGA and SMD Rework System



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Part Number:  8007-0575
Brand:  PACE

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 1800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

Top-Side Heater: Fast Heat Up - Rapid Cool Down

TF 1800 Inductive-Convection Chart
PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 1800 immediately drops to temperatures well below solder melt when the heater is de-energized (results shown for TF 1800 Heater).




How Inductive-Convection Heating Works

The TF 1800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

inductive heaters
1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling, the induction coil is de-energized and the TF 1800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.

Powerful, Energy Efficient Performance

The TF 1800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

Advanced Features

TF 1800 Infographic

TF 1800 BGA PlacementUltra-High Precision Placement Capability
Newly designed motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy.



TF 1800 BGA Pick-UpHigh Sensitivity Vacuum Pick Assembly
New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. Includes 7 Vacuum Picks.



TF 1800 preheater upPACE Exclusive Height Adjustable Bottom-Side Preheater
High powered medium/long wave quartz IR heating elements respond faster with 1000W of power. The preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.



TF 1800 Support WandIntegrated Board Support Wand
An innovative Board Support Wand prevents warping or sagging during reflow, is extremely adjustable to clear parts on the bottom of PCB, and is easily removed when not in use.



TF 1800 Hi-Def Optical Alignment CameraHigh-Definition Optical Alignment System
An automated Vision Overlay System uses a beam-splitting prism for simultaneous view of PCB pads and balls, high intensity LEDs for shadow-free lighting, and new high definition 1080p camera to easily align any component.



TF 1800 Alignment ImagesCrisp & Clear Images for Component Alignment
A high definition Vision Overlay System uses bright white LEDs with independent intensity control and up to 240x zoom capability to provide precise distinction of pads and solder ball or leads.



TF 1800 Quad-Field Imaging for Large/Fine Pitch BGA'sQuad-Field Imaging for Large/Fine Pitch BGA's
Quad-Field Imaging allows up to four corners of a large component (and its pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.



TF 1800 Software ScreenshotFourth Generation Software Suite
Newly designed Windows-based software provides a simple graphical interface with intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more.



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