TF2800 BGA and SMD Rework System, 230V



No stock, delayed despatch

Part Number:  8007-0583
Brand:  PACE

Ultra-Precise 28µm Placement Accuracy
Revolutionary Inductive-Convection Heater
Active Cooling Through Nozzle Provides Rapid Solder Cooldown
4 Thermocouple Inputs
Adjustable Height Bottom-Side IR Preheater
Board Support Beam
Precision 24" x 24" PCB Holder
Auxiliary Cooling Fan
Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
Single-Axis Operation
Windows 10 Micro PC with 24" LCB Monitor
Operator-Friendly Software Suite
Made in the USA



Power Requirements
120 VAC, 50-60Hz (requires 20 A supply)|| 230 VAC, 50-60Hz (requires 10 A supply); 1600W maximum
737mm (29") H x 1118mm (44") W x 965mm (38") D
Weight (Without Computer)
90kg (200lbs)
Top-side Heater
Inductive-Convection Heater, 300 Watts
Bottom Side Heater
Medium/Long wave IR, 1900 Watts; 405mm (16") x 405mm (16") || (1 x 1000 Watts & 6 x 150 Watts)
Bottom Heater Adjustable Height
Can be raised up to 38mm (1.5") closer to the PCB
Active Cooling Capability
Offers swift, yet controlled component/PCB cooling, directly through the nozzle
High Sensitivity Vacuum Pick 
Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)
Precision Placement Capability
Placement system utilizes a stepper motor and position encoding for precise movement
Placement Accuracy
28μm (.0011") accuracy
Integrated Board Support Beam
2 standard supports, 1 x support wand & 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.
Temperature Setting Range
Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
Max PCB Size
Maximum: 610mm x 610mm (24" x 24"); Minimum: N/A arms close down completely
Max/Min Component Size
Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.
Thermocouple Inputs
Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)
High Definition Optical Alignment
Vision Overlay System (VOS) with High Definition 1080p color camera
Vision Overlay System (VOS)
Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting
VOS Zoom Capability
Up to 240x zoom capability, with Stable Zoom and image stabilization
Quad-Field Imaging
Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification 
Single Axis Operation
All operations are complete in a single axis, eliminating risk of component movement after placement/reflow
Auxiliary Cooling Fan
Intuitive, user-friendly, Windows software guides operators through profile development and execution
Computer System
Windows 10 PC, with wireless mouse and keyboard
Video Monitor
607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
Maximum Airflow
Self contained pump, PC controlled, adjustable up to 30 SLPM
Component Nests
Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
Heat Focusing, Vented Nozzles
5 nozzles included; over 90 nozzles available
Flux Application Plate
Included; allows for automated flux dipping
Stencils/Solder Paste Application
Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process
PV-65 Pik-Vac Vacuum Wand
Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature
One Year Limited Warranty
  • Top-Side Heater: Fast Heat Up - Rapid Cool Down

    TF 1800 Inductive-Convection Chart
    PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 2800 immediately drops to temperatures well below solder melt when the heater is de-energized (results shown for TF 1800 Heater).



    How Inductive-Convection Heating Works

    The TF 2800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

    inductive heaters
    1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling, the induction coil is de-energized and the TF 2800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.

    Powerful, Energy Efficient Performance

    The TF 2800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

    Advanced Features

    TF2800 Infographic
    TF1800-BGA-SMD-Rework_placementUltra-High Precision Placement Capability
    Newly designed motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy.



    TF1800-BGA-SMD-Rework_PickHigh Sensitivity Vacuum Pick Assembly
    New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. Includes 7 Vacuum Picks.



    TF2800 Bottom-side preheaterPACE Exclusive Height Adjustable Bottom-Side Preheater
    An array of 7 high powered IR emitters respond to high mass assemblies faster with 1900W of power. Preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.



    TF2800 Vision Overlay System & CameraHigh-Definition Optical Alignment System

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